Technical specifications

sensor: HELOS BR:       0.1 µm -   875 µm
KR:       0.1 µm - 8750 µm
VARIO: 0.1 µm - 8750 µm
principle: laser diffraction1 l = 632,8 nm
dispersion: adaptable modules aerodispersion, sprays,
suspensions, emulsions
measurement: multi-element detector
frequency		 31 semi-circular elements
2000/s, permanent autofocus
evaluation: Fraunhofer Enhanced Evaluation FREE Mie Extended Evaluation
MIEE as an option
ranges: optical modules R1 to R8
performance:

accuracy
repeatability

comparability 
x10, x50, x90

 s < 2%       mean rel. SD to absolute value
s < 0.04% typical (repeated sample)
s < 0.3%   typical (riffled sample)
s < 1%      mean rel. SD
/Dx/ <         2.5% rel max. deviation
< 5%         rel. deviation in the submicron range
operation: WINDOX software WINDOWS 7 / Vista Prof. / XP Prof.
applications: laser power
protection class/type
beam diameter
(1/e²) 		5 mW
3R/IP40
R1 & R2 : 2.2 mm
R3-R5: 13 mm
R6 & R7: 26 mm
R8: 35mm
QA-system certification
reference material




validation
 standard test procedure
SiC - F1200 (x50 = 4.5 µm)
SiC - P600   ( x50 = 27µm)
SiC - P80     (x50 = 260 µm)
SiC - P50     (x50 = 430µm)
FDA approved

more ...

Add this page to my favorites Send this page to my colleague Print this page

HELOS
Particle size analysis with laser diffraction
0.1 µm - 8,750 µm

symbol: laser diffraction